Polyimide Circuit Board

Resists high temperatures up to 572 f 300 c.

Polyimide circuit board.

Isola is a leading global material sciences company that designs develops and manufactures laminate materials used to fabricate advanced multilayer printed circuit boards which provide the physical platforms for the semiconductors passive components and connection circuitry that power and control virtually all modern. Polyimides also found in flexible printed circuit boards are imide monomer polyimides. It provides good mechanical strength and heat resistance to the pcb. Polyimide is a flexible polymeric film often used as a substrate for printed circuit boards.

Amber high temperature polyimide with an ultra durable adhesive withstands the extreme wash protocol and cleaning chemicals used in printed circuit board manufacturing. Consumer electronics are not the same thing as computer electronics. The polyimides that are used in the flex pcbs are generally imide monomer polyimides. 33n is a flame retardant ul 94 vo polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance.

The thermal conductivity of this material is far better than that of the fr4 material. This is a broader category that includes many consumer focused goods that require circuit boards and. This is particularly true with the increasing popularity of electronic and smart cars where a polyimide circuit board may be the only practical choice. High tg 250 c results in low overall processing and minimizes risk of latent pth defects in service.

High temperature polyimide b 727 withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling. It is known for its good thermal stability and chemical resistance values. Polyimide material is most commonly used in the flexible printed circuit boards. Polyimide occurs naturally in nature but can also be prepared synthetically.

Polyimide isola offers a product line of polyimide based no flow prepreg materials for high temperature printed circuit applications these products consist of a flame resistant polyimide resin system suitable for military commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. Tg greater than 250 c. Ultra durable adhesive is designed for use with extreme wash protocol and cleaning chemicals and is ideal for use in auto apply equipment. If you are planning to use your pcb in a high heat setting an fr4 board is probably not the best choice.

The military or defense pcbs use polyimide as a substrate.